1:1 real machine mold opening for full-screen coverage and integrated molding.
Anti-dust, anti-white edge, and anti-peeling design.
Full-screen coverage with a slight margin to allow sufficient space for phone case wrapping, enhancing protection.
Upgraded ultrasonic instant unlock with light touch and instant response.
Upgraded invisible thickness with custom high-cost 0.25mm ultra-thin glass substrate for enhanced sensitivity.
High-temperature tempered glass combining Nanjing Glass high-alumina glass and CNC technology for tough protection.
Scratch-resistant and wear-resistant with 9H hardness to easily resist daily scratches and wear.
High transparency material with up to 90% light transmittance for an original screen visual experience.
2.5D arc edge design with CNC cutting process for smooth, rounded edges that feel comfortable and do not cut hands.
Notes:
Data based on PISEN laboratory tests; actual usage environment may vary.
| Width | 9.6 |
| Height | 2.2 |
| NetWeight | 0.1 |
| Brand | PISEN |
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